Hong Leong Undergraduate Scholarship Programme 2017
The Hong Leong Undergraduate Scholarship Programme 2017 application is currently opened and ongoing. This undergraduate scholarship programme is very reliable. All prospective applicants are to read the procedures and application requirements below.
About the programme:
This non-bonded scholarship has traditionally been the backbone of the Foundation to benefit Malaysian students from low-income families and it was primarily the reason the Foundation was set up. The Foundation believes that providing scholarships is about providing opportunities – giving a chance to students to have the higher education necessary to come into their own and be the next generation of leaders and captains of industry.
The agreed-upon scholarship payment will be banked into the student’s Hong Leong Bank account (for public institution students) or paid directly to the institution (for private institution students) once a year. Our scholars are required to submit their invoice and receipt to Hong Leong Foundation for administrative purpose.
Hong Leong Foundation scholarship is NOT a loan so you don’t have to pay anything back.
Our scholarship is non-bonding, which means that there is no obligation to serve the Group after your graduate. However, you are welcome to explore employment opportunities with the Group upon graduation.
What are the courses/fields of study offered?
The scholarship is awarded for ANY course or field of study as long as it is a full-time Undergraduate Studies (1st degree course) or Diploma Course at recognised public and private universities and colleges in Malaysia.
Those pursuing STPM, A-Levels, Matriculation, Foundation, Pre-U, and equivalent courses are not eligible.
What are the academic requirements for sponsorship?
SPM : Minimum 8As
UEC : Minimum 6As
STPM / Matriculation / A-Level / Foundation / Diploma / Degree : Minimum CGPA of 3.5
Who can apply?
It is open to Malaysian citizens aged between 17 – 25 years, who have recently doing their Diploma or Degree programme in any recognised local colleges and universities can also apply.
(Please take note that the scholarship is only for full time courses conducted in Malaysia only.)
How much is the scholarship amount?
- Undergraduate studies in Public Universities > RM 8,500/= p.a.
- Diploma/Advanced Diploma courses in Public Universities > RM 6,000/= p.a.
- Undergraduate studies at local private universities > up to RM 24,000/= p.a.
- (“3+0” degree programmes on full-time and on-campus basis)Medicine/Dentistry courses in local Private Universities > up to RM 32,000/= p.a
What other benefits come with the scholarship?
Apart from financial assistance, the Hong Leong Foundation Scholarship Programme also offers opportunities for industrial training at relevant group subsidiary companies. Throughout the tenure of the scholarship, the Foundation will also organise various enrichment programmes such as leadership or motivational camps, talks, seminars, factory tours, career development day, etc. for the benefit of scholars.
The scholarship application will be from 1st April 2017 – 1st June 2017. All applications must be received by this time to be considered.
Late applications will not be considered.
How To Apply?
You have to apply online at http://www.hongleongfoundation.org/hlf-grad-application/
Only shortlisted candidates will be notified (usually through email and telephone) for an interview. If you do not hear from the Foundation after the end of July 2017, you may consider your application unsuccessful.
If you are shortlisted, you will be informed of the interview date. Please make sure that the phone number you provide and your email address is correct!
The interview for short-listed candidates will be held at Wisma Hong Leong, Kuala Lumpur. The interview session itself will last between 20 to 30 minutes. In addition, candidates will have to complete an essay on site. Please plan to arrive early for your interview session.
For additional information or inquiries, please contact:
The Hong Leong Foundation Secretariat at email@example.com